GOLD Bonding Wire for Semiconductor Packaging

Our company has been established since 1974, >40 years ago in South Korea.  Today we have 6 factories, 500 employees with a sales of US$600M (2015).

We started ISO9001 certified Gold Bonding wire business in 1996, over the years, we expanded into gold, copper, silver and alloy bonding wires.

The diameter of the wire ranges from 15 micrometer to several hundred micro-meters for high-powered applications. Our Gold Bonding wires continue to serve the packaging material market for decades through our continuous improving R&D effort.

The analysts forecast the global bonding wire packaging material market will generate revenues of USD 2.9 billion in 2020.

 

 

 

Below is the general reference of specifications of Gold Bonding Wire and its application/feature:

Typical special GOLD Bonding Wire is good for below applications:

Short Loop
Long Loop
Multilevel Loop

Contact SKYMART.

www.Skymart-Technologies.com